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Tag: TSMC

Aerial view of a large, modern industrial complex with white rooftops and curved structures—possibly Intel's Foundry—surrounded by roads, construction areas, and a sprawling cityscape under a clear blue sky.
News

Apple is Reportedly Using Intel’s Foundry for the M7 and Future...

Gavin Bonshor - May 15, 2026 0
Four colorful square tiles with technology-related logos, including Apple and AMD, sit on a reflective, multicolored silicon wafer—possibly hinting at TSMC 2nm innovation. Each tile is green, blue, red, or yellow with a distinct white icon.
Analysis

TSMC 2nm (N2) Is Here, and Capacity Will Decide the Winners:...

Gavin Bonshor - February 5, 2026 1
A graphic shows two groups of overlapping blue rectangles, illustrating chiplet-first designs: the larger left group connects to multiple lines and dots, while the smaller right group is unconnected—all on a dark background, hinting at Moore’s Law beyond 2026.
Analysis

Beyond Moore’s Law: Why chiplet-first designs will dominate 2026

Gavin Bonshor - November 11, 2025 0
A close-up of a Micron HBM4 memory chip, labeled “micron HBM4,” sits beside an exposed view showing intricate circuitry on a gold-colored substrate—essential technology for AI accelerators—set against a black background.
News

Micron’s HBM4 clears 2.8 TB/s with samples shipping — HBM4E custom...

Gavin Bonshor - October 3, 2025 0
Tweets by gavbon86
DRAM Pricing Deep Dive: Current Market Analysis, Six-Month Trends, and a Rigorous 2027 Forecast with Sensitivity ModelingDRAM Pricing Deep Dive: Current Market Analysis, Six-Month Trends, and a Rigorous 2027 Forecast with Sensitivity ModelingFebruary 27, 2026Gavin Bonshor
Apple M5 Pro & M5 Max: The Most Important Mac Chips in Years AnalyzedApple M5 Pro & M5 Max: The Most Important Mac Chips in Years AnalyzedMarch 8, 2026Gavin Bonshor
AM5 vs LGA1851: Lane Maps, USB4/TB, Upgrade Paths & Total Platform CostAM5 vs LGA1851: Lane Maps, USB4/TB, Upgrade Paths & Total Platform CostSeptember 19, 2025Gavin Bonshor
The AI Memory Crisis: An Exhaustive Technical Analysis of HBM Architecture, DRAM Cell Physics, TSV Fabrication, Advanced Packaging Chemistry, CXL Protocol Architecture, and the Bandwidth WallThe AI Memory Crisis: An Exhaustive Technical Analysis of HBM Architecture, DRAM Cell Physics, TSV Fabrication, Advanced Packaging Chemistry, CXL Protocol Architecture, and the Bandwidth WallFebruary 25, 2026Gavin Bonshor
Why Intel Still Trails AMD on Power EfficiencyWhy Intel Still Trails AMD on Power EfficiencyNovember 16, 2025Gavin Bonshor
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