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Close-up of a black circuit board featuring a central gray chip with the SiFive logo, showcasing RISC-V SoC technology. Text on the board reads SiFive HiFive Unleashed, with various electronic components and traces visible.

Inside the PIC64-HPSC: the SiFive powered RISC-V SoC that NASA intends...

April 2, 2026
Block diagram showing the architecture of the Apple M5 Max chip, part of the latest Mac chips lineup, with performance cores, efficiency cores, GPU, and neural engine on the left, and memory cache, video engine, and controllers on the right.

Apple M5 Pro & M5 Max: The Most Important Mac Chips...

March 8, 2026
Stacks of DRAM memory chips with a rising red arrow over financial charts, illustrating increasing DRAM pricing. Text reads: DRAM Pricing Deep Dive: Current Market Analysis, Six-Month Trends, and a Rigorous 2027 Forecast with Sensitivity Modeling.

DRAM Pricing Deep Dive: Current Market Analysis, Six-Month Trends, and a...

February 27, 2026
A diagram showing a central SoC (System on Chip) connected to four HBM4 memory stacks on an interposer, with colorful lines illustrating HBM Architecture and high bandwidth memory (HBM PHY) interfaces.

The AI Memory Crisis: An Exhaustive Technical Analysis of HBM Architecture,...

February 25, 2026
A digital illustration of the AMD Instinct MI300 AI accelerator features a powerful AMD chip at the center, flanked by stacks labeled HBM3 192GB, with specs for FP16/BF16, INT8/FP8, and 5.3TB/s bandwidth on a tech-themed background.

Meta’s Multibillion-Dollar AMD Chip Bet: 6GW Of Instinct GPUs, A 10%...

February 24, 2026
A stack of Samsung HBM4 DRAM memory chips sits on a circuit board with a digital background. Text overlay reads: Samsung’s 36GB 3.3TB/s HBM4 DRAM Explained – What ISSCC 2026 Reveals About AI Memory Performance.

Samsung’s 36GB 3.3TB/s HBM4 DRAM Explained: What ISSCC 2026 Reveals About...

February 22, 2026
Four colorful square tiles with technology-related logos, including Apple and AMD, sit on a reflective, multicolored silicon wafer—possibly hinting at TSMC 2nm innovation. Each tile is green, blue, red, or yellow with a distinct white icon.

TSMC 2nm (N2) Is Here, and Capacity Will Decide the Winners:...

February 5, 2026
A person wearing a textured, dark jacket holds up an NVIDIA computer chip with visible circuitry and labels, displaying it between their thumb and fingers—possibly unveiling technology at CES 2026.

NVIDIA at CES 2026: Vera Rubin Dominates the Keynote Address

January 8, 2026
Close-up of a blue DDR5 DRAM module with black memory chips, placed on a gray surface. Three detached black chips are lying next to the module.

AI Is Eating All The DRAM: Why Memory Prices Are Out...

November 17, 2025
Logos of Intel and AMD side by side on a white background. Intel's blue logo, featuring the circular swoosh, hints at innovations like Xeon and Diamond Rapids, while AMD’s bold black letters display its distinctive arrow symbol.

Intel Kills Mainstream Diamond Rapids Platform: What It Means For Xeon...

November 16, 2025
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Inside the PIC64-HPSC: the SiFive powered RISC-V SoC that NASA intends to fly on every future missionInside the PIC64-HPSC: the SiFive powered RISC-V SoC that NASA intends to fly on every future missionApril 2, 2026Gavin Bonshor
Supermicro Co-Founder Wally Liaw Arrested: The Full Story of a Governance Failure Years in the MakingSupermicro Co-Founder Wally Liaw Arrested: The Full Story of a Governance Failure Years in the MakingMarch 20, 2026Gavin Bonshor
Apple M5 Pro & M5 Max: The Most Important Mac Chips in Years AnalyzedApple M5 Pro & M5 Max: The Most Important Mac Chips in Years AnalyzedMarch 8, 2026Gavin Bonshor
Dell XPS 13 9345 Review: Snapdragon X Elite in the Thinnest XPS YetDell XPS 13 9345 Review: Snapdragon X Elite in the Thinnest XPS YetMarch 23, 2026Gavin Bonshor
The AI Memory Crisis: An Exhaustive Technical Analysis of HBM Architecture, DRAM Cell Physics, TSV Fabrication, Advanced Packaging Chemistry, CXL Protocol Architecture, and the Bandwidth WallThe AI Memory Crisis: An Exhaustive Technical Analysis of HBM Architecture, DRAM Cell Physics, TSV Fabrication, Advanced Packaging Chemistry, CXL Protocol Architecture, and the Bandwidth WallFebruary 25, 2026Gavin Bonshor
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