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Logos of AMD and Intel are displayed side by side on a dark blue background, separated by a vertical white line, symbolizing a comparison of their efficiency.
Opinion

Why Intel Still Trails AMD on Power Efficiency

Gavin Bonshor - November 16, 2025 3
The Intel logo with the words engineering the future appears on a blue background featuring a glowing Intel microchip and circuit board design.
Opinion

Intel in 2026: What To Expect Across Client, Desktop, and Xeon

Gavin Bonshor - November 15, 2025 0
A man wearing glasses and a suit exudes confidence, reflecting the sharp intelligence often associated with Intel professionals.
Opinion

Intel After Gelsinger: Packaging, PowerVia, and the Real Work Lip-Bu Tan...

Gavin Bonshor - November 12, 2025 0
A close-up of a computer processor chip featuring intricate purple circuitry patterns, surrounded by a green and metallic frame with printed text, a QR code, and AVX-512 support—ideal for PC and Server Buyers seeking advanced performance.
Opinion

AMD Zen 6 And AVX-512: What PC And Server Buyers Should...

Gavin Bonshor - November 10, 2025 1
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Inside the PIC64-HPSC: the SiFive powered RISC-V SoC that NASA intends to fly on every future missionInside the PIC64-HPSC: the SiFive powered RISC-V SoC that NASA intends to fly on every future missionApril 2, 2026Gavin Bonshor
Supermicro Co-Founder Wally Liaw Arrested: The Full Story of a Governance Failure Years in the MakingSupermicro Co-Founder Wally Liaw Arrested: The Full Story of a Governance Failure Years in the MakingMarch 20, 2026Gavin Bonshor
Apple M5 Pro & M5 Max: The Most Important Mac Chips in Years AnalyzedApple M5 Pro & M5 Max: The Most Important Mac Chips in Years AnalyzedMarch 8, 2026Gavin Bonshor
Dell XPS 13 9345 Review: Snapdragon X Elite in the Thinnest XPS YetDell XPS 13 9345 Review: Snapdragon X Elite in the Thinnest XPS YetMarch 23, 2026Gavin Bonshor
The AI Memory Crisis: An Exhaustive Technical Analysis of HBM Architecture, DRAM Cell Physics, TSV Fabrication, Advanced Packaging Chemistry, CXL Protocol Architecture, and the Bandwidth WallThe AI Memory Crisis: An Exhaustive Technical Analysis of HBM Architecture, DRAM Cell Physics, TSV Fabrication, Advanced Packaging Chemistry, CXL Protocol Architecture, and the Bandwidth WallFebruary 25, 2026Gavin Bonshor
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