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Intel Kills Mainstream Diamond Rapids Platform: What It Means For Xeon...

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Intel has quietly killed its mainstream next-generation Xeon platform. Diamond Rapids is still coming for the high end with sixteen memory channels, but the...

Why Intel Still Trails AMD on Power Efficiency

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AMD spent the last decade turning power efficiency into a weapon. Zen took them from the value bin to the point where they could...

Intel in 2026: What To Expect Across Client, Desktop, and Xeon

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Intel heads into 2026 with a technology stack that finally matches the job at hand. RibbonFET to tidy the device physics, PowerVia to clean...

HBM4 and Packaging in 2026: The Bottleneck No One Wants To...

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2026 will not be won by a shinier compute tile, but it'll be won by the teams that can bolt enough healthy HBM onto...

Valve Steam Machine Deep Dive: Specs, Strategy, And Who It Is...

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Valve’s Steam Machine is a living room PC that behaves like a console. It runs SteamOS, boots to a controller UI, and targets 4K...

NVIDIA Rubin CPX Explained: Disaggregated Inference And The Cost Of Million-Token...

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NVIDIA’s Rubin platform splits long-context prefill from token decode. Rubin CPX handles the compute-heavy front half, standard Rubin handles bandwidth-heavy generation. The NVL144 CPX...

AMD’s Ryzen 5 7500X3D: Budget X3D for AM5, Built for Gaming

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AMD’s Ryzen 5 7500X3D brings 3D V-Cache to a six-core Zen 4 part on AM5. This is the budget gaming play for users who...

AI PC Reality Check: NPU, CPU, GPU

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AI PCs promise big changes. The truth is smaller and more practical. NPUs help in narrow, always on jobs where power matters more than...

Intel After Gelsinger: Packaging, PowerVia, and the Real Work Lip-Bu Tan...

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Pat Gelsinger gave Intel what it needed. A modern blueprint that puts chiplets, packaging, and device physics at the center of performance. He also...

Beyond Moore’s Law: Why chiplet-first designs will dominate 2026

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Transistor scaling is slowing, but the industry has another gearbox. Chiplets and advanced packaging turn one huge die into multiple smaller, easier to yield...