Facebook X Vimeo VKontakte Youtube
Facebook X Vimeo VKontakte Youtube
Home Tags TSV

Tag: TSV

A diagram showing a central SoC (System on Chip) connected to four HBM4 memory stacks on an interposer, with colorful lines illustrating HBM Architecture and high bandwidth memory (HBM PHY) interfaces.
Analysis

The AI Memory Crisis: An Exhaustive Technical Analysis of HBM Architecture,...

Gavin Bonshor - 0
A stack of Samsung HBM4 DRAM memory chips sits on a circuit board with a digital background. Text overlay reads: Samsung’s 36GB 3.3TB/s HBM4 DRAM Explained – What ISSCC 2026 Reveals About AI Memory Performance.
Analysis

Samsung’s 36GB 3.3TB/s HBM4 DRAM Explained: What ISSCC 2026 Reveals About...

Gavin Bonshor - 0
Two SK Hynix HBM4 memory chips are shown; one chip displays the label “HBM4” while the other is flipped to reveal its gold connector side, highlighting advanced packaging. Both are set on a plain white background.
Analysis

HBM4 and Packaging in 2026: The Bottleneck No One Wants To...

Gavin Bonshor - 0
© BonTech Labs 2026