thermals Archives | BonTech Labs

Two SK Hynix HBM4 memory chips are shown; one chip displays the label “HBM4” while the other is flipped to reveal its gold connector side, highlighting advanced packaging. Both are set on a plain white background.

HBM4 and Packaging in 2026: The Bottleneck No One Wants To Own

November 14, 2025 Gavin Bonshor 0

2026 will not be won by a shinier compute tile, but it’ll be won by the teams that can bolt enough healthy HBM onto a […]

A graphic shows two groups of overlapping blue rectangles, illustrating chiplet-first designs: the larger left group connects to multiple lines and dots, while the smaller right group is unconnected—all on a dark background, hinting at Moore’s Law beyond 2026.

Beyond Moore’s Law: Why chiplet-first designs will dominate 2026

November 11, 2025 Gavin Bonshor 0

Transistor scaling is slowing, but the industry has another gearbox. Chiplets and advanced packaging turn one huge die into multiple smaller, easier to yield dies […]