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Home Tags Semiconductor

Tag: semiconductor

Aerial view of a large, modern industrial complex with white rooftops and curved structures—possibly Intel's Foundry—surrounded by roads, construction areas, and a sprawling cityscape under a clear blue sky.
News

Apple is Reportedly Using Intel’s Foundry for the M7 and Future...

Gavin Bonshor - May 15, 2026 0
A stack of Samsung HBM4 DRAM memory chips sits on a circuit board with a digital background. Text overlay reads: Samsung’s 36GB 3.3TB/s HBM4 DRAM Explained – What ISSCC 2026 Reveals About AI Memory Performance.
Analysis

Samsung’s 36GB 3.3TB/s HBM4 DRAM Explained: What ISSCC 2026 Reveals About...

Gavin Bonshor - February 22, 2026 0
Tweets by gavbon86
DRAM Pricing Deep Dive: Current Market Analysis, Six-Month Trends, and a Rigorous 2027 Forecast with Sensitivity ModelingDRAM Pricing Deep Dive: Current Market Analysis, Six-Month Trends, and a Rigorous 2027 Forecast with Sensitivity ModelingFebruary 27, 2026Gavin Bonshor
Apple M5 Pro & M5 Max: The Most Important Mac Chips in Years AnalyzedApple M5 Pro & M5 Max: The Most Important Mac Chips in Years AnalyzedMarch 8, 2026Gavin Bonshor
AM5 vs LGA1851: Lane Maps, USB4/TB, Upgrade Paths & Total Platform CostAM5 vs LGA1851: Lane Maps, USB4/TB, Upgrade Paths & Total Platform CostSeptember 19, 2025Gavin Bonshor
The AI Memory Crisis: An Exhaustive Technical Analysis of HBM Architecture, DRAM Cell Physics, TSV Fabrication, Advanced Packaging Chemistry, CXL Protocol Architecture, and the Bandwidth WallThe AI Memory Crisis: An Exhaustive Technical Analysis of HBM Architecture, DRAM Cell Physics, TSV Fabrication, Advanced Packaging Chemistry, CXL Protocol Architecture, and the Bandwidth WallFebruary 25, 2026Gavin Bonshor
FSR vs XeSS vs DLSS: The Upscaling Trifecta AnalyzedFSR vs XeSS vs DLSS: The Upscaling Trifecta AnalyzedSeptember 16, 2025Gavin Bonshor
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