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Home Tags Power efficiency

Tag: power efficiency

Logos of AMD and Intel are displayed side by side on a dark blue background, separated by a vertical white line, symbolizing a comparison of their efficiency.
Opinion

Why Intel Still Trails AMD on Power Efficiency

Gavin Bonshor - November 16, 2025 3
A close-up view of an AMD Ryzen 5 7500X3D processor on a metallic AM5 surface with red accents. The silver chip features the AMD Ryzen logo prominently displayed, highlighting its appeal for high-performance gaming rigs.
News

AMD’s Ryzen 5 7500X3D: Budget X3D for AM5, Built for Gaming

Gavin Bonshor - November 13, 2025 0
Close-up of a computer chip labeled NPU with a brain-shaped circuit design, mounted on an AI PC motherboard alongside visible electronic components.
Analysis

AI PC Reality Check: NPU, CPU, GPU

Gavin Bonshor - November 12, 2025 0
Close-up of an electronic circuit board with a large NextSilicon Maverick-2 RISC-V chip, surrounded by capacitors and other components. A green and red reflection is visible on the chip’s surface.
News

NextSilicon Maverick-2 claims GPU-beating speeds, teases RISC-V based ‘Arbel’ chip

Gavin Bonshor - October 22, 2025 0
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Inside the PIC64-HPSC: the SiFive powered RISC-V SoC that NASA intends to fly on every future missionInside the PIC64-HPSC: the SiFive powered RISC-V SoC that NASA intends to fly on every future missionApril 2, 2026Gavin Bonshor
Supermicro Co-Founder Wally Liaw Arrested: The Full Story of a Governance Failure Years in the MakingSupermicro Co-Founder Wally Liaw Arrested: The Full Story of a Governance Failure Years in the MakingMarch 20, 2026Gavin Bonshor
Apple M5 Pro & M5 Max: The Most Important Mac Chips in Years AnalyzedApple M5 Pro & M5 Max: The Most Important Mac Chips in Years AnalyzedMarch 8, 2026Gavin Bonshor
Dell XPS 13 9345 Review: Snapdragon X Elite in the Thinnest XPS YetDell XPS 13 9345 Review: Snapdragon X Elite in the Thinnest XPS YetMarch 23, 2026Gavin Bonshor
The AI Memory Crisis: An Exhaustive Technical Analysis of HBM Architecture, DRAM Cell Physics, TSV Fabrication, Advanced Packaging Chemistry, CXL Protocol Architecture, and the Bandwidth WallThe AI Memory Crisis: An Exhaustive Technical Analysis of HBM Architecture, DRAM Cell Physics, TSV Fabrication, Advanced Packaging Chemistry, CXL Protocol Architecture, and the Bandwidth WallFebruary 25, 2026Gavin Bonshor
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