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A stack of Samsung HBM4 DRAM memory chips sits on a circuit board with a digital background. Text overlay reads: Samsung’s 36GB 3.3TB/s HBM4 DRAM Explained – What ISSCC 2026 Reveals About AI Memory Performance.
Analysis

Samsung’s 36GB 3.3TB/s HBM4 DRAM Explained: What ISSCC 2026 Reveals About...

Gavin Bonshor - 0
The Intel logo with the words engineering the future appears on a blue background featuring a glowing Intel microchip and circuit board design.
Opinion

Intel in 2026: What To Expect Across Client, Desktop, and Xeon

Gavin Bonshor - 0
Two SK Hynix HBM4 memory chips are shown; one chip displays the label “HBM4” while the other is flipped to reveal its gold connector side, highlighting advanced packaging. Both are set on a plain white background.
Analysis

HBM4 and Packaging in 2026: The Bottleneck No One Wants To...

Gavin Bonshor - 0
Close-up of a computer chip labeled NPU with a brain-shaped circuit design, mounted on an AI PC motherboard alongside visible electronic components.
Analysis

AI PC Reality Check: NPU, CPU, GPU

Gavin Bonshor - 0
A man wearing glasses and a suit exudes confidence, reflecting the sharp intelligence often associated with Intel professionals.
Opinion

Intel After Gelsinger: Packaging, PowerVia, and the Real Work Lip-Bu Tan...

Gavin Bonshor - 0
A close-up of a Micron HBM4 memory chip, labeled “micron HBM4,” sits beside an exposed view showing intricate circuitry on a gold-colored substrate—essential technology for AI accelerators—set against a black background.
News

Micron’s HBM4 clears 2.8 TB/s with samples shipping — HBM4E custom...

Gavin Bonshor - 0
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