Intel in 2026: What To Expect Across Client, Desktop, and Xeon
Intel heads into 2026 with a technology stack that finally matches the job at hand. RibbonFET to tidy the device physics, PowerVia to clean up […]
Packaging
HBM4 and Packaging in 2026: The Bottleneck No One Wants To Own
2026 will not be won by a shinier compute tile, but it’ll be won by the teams that can bolt enough healthy HBM onto a […]
AI PC Reality Check: NPU, CPU, GPU
AI PCs promise big changes. The truth is smaller and more practical. NPUs help in narrow, always on jobs where power matters more than time […]
Intel After Gelsinger: Packaging, PowerVia, and the Real Work Lip-Bu Tan Must Finish
Pat Gelsinger gave Intel what it needed. A modern blueprint that puts chiplets, packaging, and device physics at the center of performance. He also tried […]
Micron’s HBM4 clears 2.8 TB/s with samples shipping — HBM4E custom base die points to bespoke AI accelerators
Micron says its next-gen HBM4 already exceeds 2.8 TB/s per stack with >11 Gb/s pin speeds, and that it’s begun shipping customer samples. The company […]