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A diagram showing a central SoC (System on Chip) connected to four HBM4 memory stacks on an interposer, with colorful lines illustrating HBM Architecture and high bandwidth memory (HBM PHY) interfaces.
Analysis

The AI Memory Crisis: An Exhaustive Technical Analysis of HBM Architecture,...

Gavin Bonshor - 0
A stack of Samsung HBM4 DRAM memory chips sits on a circuit board with a digital background. Text overlay reads: Samsung’s 36GB 3.3TB/s HBM4 DRAM Explained – What ISSCC 2026 Reveals About AI Memory Performance.
Analysis

Samsung’s 36GB 3.3TB/s HBM4 DRAM Explained: What ISSCC 2026 Reveals About...

Gavin Bonshor - 0
A person wearing a textured, dark jacket holds up an NVIDIA computer chip with visible circuitry and labels, displaying it between their thumb and fingers—possibly unveiling technology at CES 2026.
Analysis

NVIDIA at CES 2026: Vera Rubin Dominates the Keynote Address

Gavin Bonshor - 0
Two SK Hynix HBM4 memory chips are shown; one chip displays the label “HBM4” while the other is flipped to reveal its gold connector side, highlighting advanced packaging. Both are set on a plain white background.
Analysis

HBM4 and Packaging in 2026: The Bottleneck No One Wants To...

Gavin Bonshor - 0
A close-up and internal view of a high-performance computer server, showcasing stacked components and detailed circuitry—featuring the NVIDIA Rubin CPX for disaggregated inference, with a highlighted section zooming in on chips and hardware inside the server.
Analysis

NVIDIA Rubin CPX Explained: Disaggregated Inference And The Cost Of Million-Token...

Gavin Bonshor - 0
A close-up of a Micron HBM4 memory chip, labeled “micron HBM4,” sits beside an exposed view showing intricate circuitry on a gold-colored substrate—essential technology for AI accelerators—set against a black background.
News

Micron’s HBM4 clears 2.8 TB/s with samples shipping — HBM4E custom...

Gavin Bonshor - 0
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