Aehr Test Systems and ISE Labs put wafer level burn in at the center of AI chip reliability
Aehr Test Systems and ISE Labs are pushing a simple idea into a complex part of the AI supply chain: stress AI dies earlier, while […]
HBM
China’s latest chip “breakthrough” is really about building a domestic lithography stack
TrendForce reports that Chinese chipmakers and equipment firms are hailing a new “breakthrough” in chip technology that supposedly paves the way for more advanced lithography […]
YMTC eyes a $40B+ China IPO: what it means for NAND pricing, sanctions workarounds, and China’s memory stack
China’s top NAND maker, Yangtze Memory Technologies Co. (YMTC), is weighing a mainland IPO for 2026 at a valuation that could top $40 billion, per […]
NVIDIA’s first U.S. Blackwell wafer: signal or showpiece?
NVIDIA and TSMC stood on a stage in Arizona and showed off something real: the first U.S.-made Blackwell wafer. On the surface, that’s a headline […]
CXMT targets $42B Shanghai IPO to power China’s DRAM push
China’s leading DRAM maker CXMT is preparing a Shanghai listing that could value it at up to $42B as early as Q1 2026. The raise […]
Samsung & SK Hynix sign on for OpenAI’s “Stargate”
Seoul says Samsung and SK Hynix signed letters of intent to supply memory for OpenAI’s Stargate buildout — a big signal for 2026–27 HBM demand. […]
Micron Says HBM4 Samples Are Hitting 2.8 TB/s; GDDR7 at 40 Gbps
Micron is openly talking HBM4 now—and the numbers are punchy: over 2.8 TB/s per stack at pin speeds north of 11 Gb/s, plus GDDR7 binned to 40 Gb/s. […]