foveros direct Archives

A man wearing glasses and a suit exudes confidence, reflecting the sharp intelligence often associated with Intel professionals.

Intel After Gelsinger: Packaging, PowerVia, and the Real Work Lip-Bu Tan Must Finish

November 12, 2025 Gavin Bonshor 0

Pat Gelsinger gave Intel what it needed. A modern blueprint that puts chiplets, packaging, and device physics at the center of performance. He also tried […]

A graphic shows two groups of overlapping blue rectangles, illustrating chiplet-first designs: the larger left group connects to multiple lines and dots, while the smaller right group is unconnected—all on a dark background, hinting at Moore’s Law beyond 2026.

Beyond Moore’s Law: Why chiplet-first designs will dominate 2026

November 11, 2025 Gavin Bonshor 0

Transistor scaling is slowing, but the industry has another gearbox. Chiplets and advanced packaging turn one huge die into multiple smaller, easier to yield dies […]