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    Home Opinion
    Logos of AMD and Intel are displayed side by side on a dark blue background, separated by a vertical white line, symbolizing a comparison of their efficiency.

    Why Intel Still Trails AMD on Power Efficiency

    November 16, 2025
    The Intel logo with the words engineering the future appears on a blue background featuring a glowing Intel microchip and circuit board design.

    Intel in 2026: What To Expect Across Client, Desktop, and Xeon

    November 15, 2025
    A man wearing glasses and a suit exudes confidence, reflecting the sharp intelligence often associated with Intel professionals.

    Intel After Gelsinger: Packaging, PowerVia, and the Real Work Lip-Bu Tan...

    November 12, 2025
    A close-up of a computer processor chip featuring intricate purple circuitry patterns, surrounded by a green and metallic frame with printed text, a QR code, and AVX-512 support—ideal for PC and Server Buyers seeking advanced performance.

    AMD Zen 6 And AVX-512: What PC And Server Buyers Should...

    November 10, 2025
    Tweets by gavbon86
    Intel Is Not Killing P-Cores and E-Cores Yet: Why the “Unified Core” Headline Gets Ahead of the EvidenceIntel Is Not Killing P-Cores and E-Cores Yet: Why the “Unified Core” Headline Gets Ahead of the EvidenceFebruary 23, 2026Gavin Bonshor
    TSMC 2nm (N2) Is Here, and Capacity Will Decide the Winners: Apple, AMD, Nvidia, Intel, and the 2026 Pricing RealityTSMC 2nm (N2) Is Here, and Capacity Will Decide the Winners: Apple, AMD, Nvidia, Intel, and the 2026 Pricing RealityFebruary 5, 2026Gavin Bonshor
    The 2025 BIOS/UEFI Optimization Handbook: Safe Settings That Actually HelpThe 2025 BIOS/UEFI Optimization Handbook: Safe Settings That Actually HelpSeptember 19, 2025Gavin Bonshor
    AI Is Eating All The DRAM: Why Memory Prices Are Out Of ControlAI Is Eating All The DRAM: Why Memory Prices Are Out Of ControlNovember 17, 2025Gavin Bonshor
    The AI Memory Crisis: An Exhaustive Technical Analysis of HBM Architecture, DRAM Cell Physics, TSV Fabrication, Advanced Packaging Chemistry, CXL Protocol Architecture, and the Bandwidth WallThe AI Memory Crisis: An Exhaustive Technical Analysis of HBM Architecture, DRAM Cell Physics, TSV Fabrication, Advanced Packaging Chemistry, CXL Protocol Architecture, and the Bandwidth WallFebruary 25, 2026Gavin Bonshor
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