YMTC’s Sanctions Squeeze: Competitive NAND, Constrained Tools
YMTC’s Sanctions Squeeze: Competitive NAND, Constrained Tools China’s premier NAND maker can build competitive 3D NAND but can’t scale without new tools. We examine market […]
YMTC’s Sanctions Squeeze: Competitive NAND, Constrained Tools China’s premier NAND maker can build competitive 3D NAND but can’t scale without new tools. We examine market […]
Jensen’s “Nanoseconds Behind” Line: What Nvidia Really Wants From Washington Nvidia’s CEO says China is “nanoseconds behind” U.S. chip tech and calls for fewer export […]
TSMC Shoots Down Intel JV Rumors — What That Really Means for Foundry Power TSMC says there were no investment asks and no JV talks […]
Intel has pushed out a new WHQL graphics package — 32.0.101.8132 — for Arc B-series/A-series and Core Ultra with built-in Arc graphics. On paper it’s […]
Intel’s driver files are now hinting at something called “XeSS Multi-Frame Generation.” On paper, that sounds like Intel’s take on modern frame-gen: extrapolating intermediate frames […]
Micron is openly talking HBM4 now—and the numbers are punchy: over 2.8 TB/s per stack at pin speeds north of 11 Gb/s, plus GDDR7 binned to 40 Gb/s. […]
Microsoft’s Windows 11 version 25H2 has quietly crossed an important threshold: the official RTM ISOs are now live on Microsoft’s servers for both x64 and […]
Reports out of Taiwan say TSMC has secured roughly 15 early adopters for its first-generation 2nm node (N2), with Apple expected to take the largest […]
NVIDIA and OpenAI’s letter of intent pairs up to $100B of NVIDIA investment with a plan to deploy at least 10 gigawatts of NVIDIA systems […]
Innosilicon’s third-gen “Fenghua” GPU arrives with big promises: CUDA compatibility, modern API support (DX12/Vulkan/OpenGL), hardware ray tracing, and configurations boasting over 112GB of HBM for […]
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