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Three computer motherboards labeled B850, X870, and X870E AI are displayed side by side on a blue background, showcasing different designs and heatsinks for both LGA1851 and AM5 platforms.
Motherboards

AM5 vs LGA1851: Lane Maps, USB4/TB, Upgrade Paths & Total Platform...

Gavin Bonshor - September 19, 2025 0
A Samsung 990 PRO V-NAND NVMe SSD, featuring PCIe 4.0 technology, M.2 form factor, and a spacious 2TB capacity. It has a sleek black design with white and red labeling, plus gold connectors on the left edge.
Storage

NVMe SSDs: PCIe 5.0 vs 4.0, Controllers, Thermals & Real-World Picks

Gavin Bonshor - September 19, 2025 0
A Micron DDR5 RDIMM 128GB memory module, featuring black memory chips on a green circuit board with gold connector pins at the bottom, optimized for low latency and advanced tuning.
Memory

DDR5 Masterclass: Capacity, Latency, and a Safe Tuning Playbook That Actually...

Gavin Bonshor - September 19, 2025 0
A black ASUS ROG motherboard with RGB lighting, multiple RAM slots, robust VRMs, PCIe lanes, and heatsinks, designed for high-performance gaming and computing.
Motherboards

Motherboard Deep Dive: VRMs, PCIe Lanes, Retimers & I/O—How to Choose...

Gavin Bonshor - September 19, 2025 0
A stylized illustration of a Wi-Fi 7 router with four antennas, radiating yellow arcs and blue digital connection lines, set against a dark blue background—perfectly capturing the speed and innovation of 802.11be MLO technology.
Guides

Wi-Fi 7 (802.11be) Explained: MLO, 320 MHz & Your Upgrade Guide

Gavin Bonshor - September 18, 2025 0
Two stylized computer RAM sticks with visible gold pins are depicted diagonally against a dark background accented by faint, wavy blue lines, evoking digital energy and advanced features like memory overclocking or XMP.
Memory

XMP vs EXPO: what to enable and why (plus the safe-tuning...

Gavin Bonshor - September 17, 2025 0
Stylized illustration of a microchip with circuit traces and flowing blue lines in the background, symbolizing VRAM requirements 2025 as data or electrical signals move through and around the chip.
GPU

VRAM explained: how much do you really need?

Gavin Bonshor - September 17, 2025 0
A simple white outline of four squares, arranged in a grid on a dark blue gradient background, resembling the Microsoft Windows logo—perfect for illustrating a safe Windows installation or showcasing the style of Windows 11 2025.
PC Basics Explained

Clean-install Windows 11: the safe, reproducible way

Gavin Bonshor - September 17, 2025 0
Five parallel horizontal white arrows point right on a dark blue gradient background, evoking the high-speed data transfer of PCIe 5.0 and GPUs, spaced evenly from top to bottom.
PC Basics Explained

PCIe 5.0 vs PCIe 4.0: do you actually notice for GPUs...

Gavin Bonshor - September 17, 2025 0
A comparison image features three neon-lit city street panels at night, labeled DLSS, FSR, and XeSS, each highlighting different visual quality levels in a vibrant cyberpunk-style setting.
PC Basics Explained

FSR vs XeSS vs DLSS: The Upscaling Trifecta Analyzed

Gavin Bonshor - September 16, 2025 0
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Tweets by gavbon86
Apple is Reportedly Using Intel's Foundry for the M7 and Future iPhone ChipsApple is Reportedly Using Intel's Foundry for the M7 and Future iPhone ChipsMay 15, 2026Gavin Bonshor
Intel in 2026: What To Expect Across Client, Desktop, and XeonIntel in 2026: What To Expect Across Client, Desktop, and XeonNovember 15, 2025Gavin Bonshor
Inside the PIC64-HPSC: the SiFive powered RISC-V SoC that NASA intends to fly on every future missionInside the PIC64-HPSC: the SiFive powered RISC-V SoC that NASA intends to fly on every future missionApril 2, 2026Gavin Bonshor
VRAM Explained (2025): How Much You Need for 1080p, 1440p & 4KVRAM Explained (2025): How Much You Need for 1080p, 1440p & 4KOctober 16, 2025Gavin Bonshor
The AI Memory Crisis: An Exhaustive Technical Analysis of HBM Architecture, DRAM Cell Physics, TSV Fabrication, Advanced Packaging Chemistry, CXL Protocol Architecture, and the Bandwidth WallThe AI Memory Crisis: An Exhaustive Technical Analysis of HBM Architecture, DRAM Cell Physics, TSV Fabrication, Advanced Packaging Chemistry, CXL Protocol Architecture, and the Bandwidth WallFebruary 25, 2026Gavin Bonshor
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