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Three computer motherboards labeled B850, X870, and X870E AI are displayed side by side on a blue background, showcasing different designs and heatsinks for both LGA1851 and AM5 platforms.
Motherboards

AM5 vs LGA1851: Lane Maps, USB4/TB, Upgrade Paths & Total Platform...

Gavin Bonshor - September 19, 2025 0
A Samsung 990 PRO V-NAND NVMe SSD, featuring PCIe 4.0 technology, M.2 form factor, and a spacious 2TB capacity. It has a sleek black design with white and red labeling, plus gold connectors on the left edge.
Storage

NVMe SSDs: PCIe 5.0 vs 4.0, Controllers, Thermals & Real-World Picks

Gavin Bonshor - September 19, 2025 0
A Micron DDR5 RDIMM 128GB memory module, featuring black memory chips on a green circuit board with gold connector pins at the bottom, optimized for low latency and advanced tuning.
Memory

DDR5 Masterclass: Capacity, Latency, and a Safe Tuning Playbook That Actually...

Gavin Bonshor - September 19, 2025 0
A black ASUS ROG motherboard with RGB lighting, multiple RAM slots, robust VRMs, PCIe lanes, and heatsinks, designed for high-performance gaming and computing.
Motherboards

Motherboard Deep Dive: VRMs, PCIe Lanes, Retimers & I/O—How to Choose...

Gavin Bonshor - September 19, 2025 0
A stylized illustration of a Wi-Fi 7 router with four antennas, radiating yellow arcs and blue digital connection lines, set against a dark blue background—perfectly capturing the speed and innovation of 802.11be MLO technology.
Guides

Wi-Fi 7 (802.11be) Explained: MLO, 320 MHz & Your Upgrade Guide

Gavin Bonshor - September 18, 2025 0
Two stylized computer RAM sticks with visible gold pins are depicted diagonally against a dark background accented by faint, wavy blue lines, evoking digital energy and advanced features like memory overclocking or XMP.
Memory

XMP vs EXPO: what to enable and why (plus the safe-tuning...

Gavin Bonshor - September 17, 2025 0
Stylized illustration of a microchip with circuit traces and flowing blue lines in the background, symbolizing VRAM requirements 2025 as data or electrical signals move through and around the chip.
GPU

VRAM explained: how much do you really need?

Gavin Bonshor - September 17, 2025 0
A simple white outline of four squares, arranged in a grid on a dark blue gradient background, resembling the Microsoft Windows logo—perfect for illustrating a safe Windows installation or showcasing the style of Windows 11 2025.
PC Basics Explained

Clean-install Windows 11: the safe, reproducible way

Gavin Bonshor - September 17, 2025 0
Five parallel horizontal white arrows point right on a dark blue gradient background, evoking the high-speed data transfer of PCIe 5.0 and GPUs, spaced evenly from top to bottom.
PC Basics Explained

PCIe 5.0 vs PCIe 4.0: do you actually notice for GPUs...

Gavin Bonshor - September 17, 2025 0
A comparison image features three neon-lit city street panels at night, labeled DLSS, FSR, and XeSS, each highlighting different visual quality levels in a vibrant cyberpunk-style setting.
PC Basics Explained

FSR vs XeSS vs DLSS: The Upscaling Trifecta Analyzed

Gavin Bonshor - September 16, 2025 0
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Tweets by gavbon86
Inside the PIC64-HPSC: the SiFive powered RISC-V SoC that NASA intends to fly on every future missionInside the PIC64-HPSC: the SiFive powered RISC-V SoC that NASA intends to fly on every future missionApril 2, 2026Gavin Bonshor
Supermicro Co-Founder Wally Liaw Arrested: The Full Story of a Governance Failure Years in the MakingSupermicro Co-Founder Wally Liaw Arrested: The Full Story of a Governance Failure Years in the MakingMarch 20, 2026Gavin Bonshor
Apple M5 Pro & M5 Max: The Most Important Mac Chips in Years AnalyzedApple M5 Pro & M5 Max: The Most Important Mac Chips in Years AnalyzedMarch 8, 2026Gavin Bonshor
Dell XPS 13 9345 Review: Snapdragon X Elite in the Thinnest XPS YetDell XPS 13 9345 Review: Snapdragon X Elite in the Thinnest XPS YetMarch 23, 2026Gavin Bonshor
The AI Memory Crisis: An Exhaustive Technical Analysis of HBM Architecture, DRAM Cell Physics, TSV Fabrication, Advanced Packaging Chemistry, CXL Protocol Architecture, and the Bandwidth WallThe AI Memory Crisis: An Exhaustive Technical Analysis of HBM Architecture, DRAM Cell Physics, TSV Fabrication, Advanced Packaging Chemistry, CXL Protocol Architecture, and the Bandwidth WallFebruary 25, 2026Gavin Bonshor
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