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    Analysis

    Home Analysis Page 2
    A close-up and internal view of a high-performance computer server, showcasing stacked components and detailed circuitry—featuring the NVIDIA Rubin CPX for disaggregated inference, with a highlighted section zooming in on chips and hardware inside the server.

    NVIDIA Rubin CPX Explained: Disaggregated Inference And The Cost Of Million-Token...

    November 13, 2025
    Close-up of a computer chip labeled NPU with a brain-shaped circuit design, mounted on an AI PC motherboard alongside visible electronic components.

    AI PC Reality Check: NPU, CPU, GPU

    November 12, 2025
    A graphic shows two groups of overlapping blue rectangles, illustrating chiplet-first designs: the larger left group connects to multiple lines and dots, while the smaller right group is unconnected—all on a dark background, hinting at Moore’s Law beyond 2026.

    Beyond Moore’s Law: Why chiplet-first designs will dominate 2026

    November 11, 2025
    Two computer chips side by side; the left chip is silver with Samsung HBM3E 12H labeling, while the right chip, possibly hinting at future HBM4 designs, is gold with a grid-like pattern and no visible text.

    Samsung’s HBM3E breakthrough sets the stage for the real fight: HBM4...

    November 11, 2025
    12Page 2 of 2
    Tweets by gavbon86
    Intel Is Not Killing P-Cores and E-Cores Yet: Why the “Unified Core” Headline Gets Ahead of the EvidenceIntel Is Not Killing P-Cores and E-Cores Yet: Why the “Unified Core” Headline Gets Ahead of the EvidenceFebruary 23, 2026Gavin Bonshor
    TSMC 2nm (N2) Is Here, and Capacity Will Decide the Winners: Apple, AMD, Nvidia, Intel, and the 2026 Pricing RealityTSMC 2nm (N2) Is Here, and Capacity Will Decide the Winners: Apple, AMD, Nvidia, Intel, and the 2026 Pricing RealityFebruary 5, 2026Gavin Bonshor
    The AI Memory Crisis: An Exhaustive Technical Analysis of HBM Architecture, DRAM Cell Physics, TSV Fabrication, Advanced Packaging Chemistry, CXL Protocol Architecture, and the Bandwidth WallThe AI Memory Crisis: An Exhaustive Technical Analysis of HBM Architecture, DRAM Cell Physics, TSV Fabrication, Advanced Packaging Chemistry, CXL Protocol Architecture, and the Bandwidth WallFebruary 25, 2026Gavin Bonshor
    The 2025 BIOS/UEFI Optimization Handbook: Safe Settings That Actually HelpThe 2025 BIOS/UEFI Optimization Handbook: Safe Settings That Actually HelpSeptember 19, 2025Gavin Bonshor
    AI Is Eating All The DRAM: Why Memory Prices Are Out Of ControlAI Is Eating All The DRAM: Why Memory Prices Are Out Of ControlNovember 17, 2025Gavin Bonshor
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