Founder of BonTech Labs. Hardware journalist focused on CPUs, chiplets, packaging, and foundry strategy. I write clean, test-driven analysis with no hype.
- Bylines at The Register and XDA Developers
- Deep coverage: chiplets, Foveros, EMIB, PowerVia, RibbonFET, HBM
- Known for blunt, data-first reviews and long-soak testing
What I do
I cover client compute and the semiconductor supply chain with a focus on engineering reality. That means sustained performance, yield math, packaging physics, and platform power behavior. If a claim needs proof, I measure it. If it wastes readers’ time, it does not run.
Selected work
- Intel after Gelsinger: packaging and PowerVia
- Why chiplet-first designs will dominate 2026
- AI PCs: NPU vs CPU vs GPU reality
Press and bylines
“Data first, no fluff. If it is not measured, it is not in the article.”
Focus areas
- CPU microarchitecture and performance
- Chiplets and die-to-die fabrics
- Advanced packaging: Foveros, EMIB, hybrid bonding
- Device physics: RibbonFET, PowerVia
- HBM, memory topology, thermals
- Foundry strategy and yield economics
Contact
For tips, review samples, or consulting, email gbonshor@bontechlabs.com. For quick responses, use X or LinkedIn.
