HBM4 and Packaging in 2026: The Bottleneck No One Wants To Own
2026 will not be won by a shinier compute tile, but it’ll be won by the teams that can bolt enough healthy HBM onto a […]
2026 will not be won by a shinier compute tile, but it’ll be won by the teams that can bolt enough healthy HBM onto a […]
Valve’s Steam Machine is a living room PC that behaves like a console. It runs SteamOS, boots to a controller UI, and targets 4K output […]
NVIDIA’s Rubin platform splits long-context prefill from token decode. Rubin CPX handles the compute-heavy front half, standard Rubin handles bandwidth-heavy generation. The NVL144 CPX rack […]
AMD’s Ryzen 5 7500X3D brings 3D V-Cache to a six-core Zen 4 part on AM5. This is the budget gaming play for users who want […]
Microsoft’s next wave of AI datacenters is not about who has the most GPUs. It is about who can energize 300 megawatts on time, keep […]
AI PCs promise big changes. The truth is smaller and more practical. NPUs help in narrow, always on jobs where power matters more than time […]
Pat Gelsinger gave Intel what it needed. A modern blueprint that puts chiplets, packaging, and device physics at the center of performance. He also tried […]
OpenAI just signed a seven year, $38 billion capacity deal with AWS. Ignore the cheerleading. This is not about a better price on instances. It […]
Transistor scaling is slowing, but the industry has another gearbox. Chiplets and advanced packaging turn one huge die into multiple smaller, easier to yield dies […]
Samsung has finally passed Nvidia’s HBM3E qualification, ending an 18 month slog that cost it design wins and credibility. It is a milestone that matters, […]
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